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KSD-T1502 间距 1.5mm

KSD-T1502 间距 1.5mm

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产品名称：线对板连接器 （通孔回流系列）
产品规格：
接触电阻：≤20mn
绝缘电阻：≥1000Mn
额定电压：250V AC DC
额定电流：3.0A AC DC
耐压：1000V AC/分钟
温度范围：-25℃-+105℃
外壳：LCP UL94V-0，天然
盖子：LCP UL94V-0，天然
触点：黄铜/镀锡
品牌：科斯达开关KSDKG
产地：中国东莞


线对板连接器（Wire-to-Board Connector）是一种常用的电子连接器，它的作用是将电缆或导线与印刷电路板（PCB）连接起来。通孔回流焊（Through-Hole Reflow Soldering）则是为这些连接器提供了一种稳定的焊接方式。

线对板连接器的特点
1.结构设计：
线对板连接器通常由插头和插座两部分组成，可以是凸点式（pin header）和凹点式（socket）设计。

具有多个针脚，可以根据需要连接多条电缆。

2.安装方式：
线对板连接器可以通过焊接、插拔等方式进行安装，确保电缆的可靠连接。
3.高可靠性：
适用于需要频繁连接和断开的场合，如工业控制、消费电子等。

通孔回流焊特点
1.焊接过程：
通孔回流焊接是将连接器插入安装在电路板上的通孔中，然后使用回流焊接工艺将连接器焊接到PCB上。

该工艺主要涉及在高温下熔化焊料，使其与连接器引脚和PCB焊盘结合形成牢固的电气连接。

2.适用范围：
通孔回流焊适用于较大电流或需要高强度连接的应用，如汽车电子、工业设备等。

选择和应用
1.选择考虑因素：
额定电流和电压：确保连接器的规格符合电流和电压条件，以保证安全性。

环境适应性：根据工作环境选择合适的材料和防护等级（如防水防尘）。

2.典型应用：
汽车电子：用于车辆中多个电子模块之间的连接。

家用电器：如洗衣机、冰箱等家电产品中的内部连接。

工业设备：用于PLC（可编程逻辑控制器）、传感器和执行器等设备中的连接。

焊接技巧
1.焊接温度控制：确保温度在适宜范围内，以防过热或焊料未能完全熔化。

2.清洁焊盘和引脚：在焊接前，应确保PCB焊盘和连接器引脚无氧化层或污垢，以提高焊接质量。

3.时间控制：回流焊的加热和冷却时间应适当控制，以保证焊接效果。

4.测试连接：焊接完成后，应进行电气测试，确保连接良好且符合设计要求。

总结
线对板连接器采用通孔回流焊接技术，可以提供可靠稳定的电气连接，是多种电子设备中不可或缺的组件。在选择和使用时，需考虑其额定参数、环境适应性以及焊接工艺深度，以确保最佳性能和可靠性。



Product Name: Wire to board connector (through-hole reflow series)
Product specifications:
Contact resistance: ≤ 20mn
Insulation resistance: ≥ 1000Mn
Rated voltage: 250V AC DC
Rated current: 3.0A AC DC
Voltage resistance: 1000V AC/min
Temperature range: -25 ℃ -+105 ℃
Shell: LCP UL94V-0, natural
Lid: LCP UL94V-0, natural
Contact: brass/tin plated
Brand: Coaster Switch KSDKG
Origin: Dongguan, China


A wire to board connector is a commonly used electronic connector that connects cables or wires to a printed circuit board (PCB). Through Hole Reflow Soldering provides a stable soldering method for these connectors.

Characteristics of wire to board connectors
1. Structural design:
Wire to board connectors typically consist of a plug and a socket, which can be designed as either a pin header or a socket.

Having multiple pins, it can connect multiple cables as needed.

2. Installation method:
Wire to board connectors can be installed through welding, plugging, and other methods to ensure reliable cable connections.
3. High reliability:
Suitable for occasions that require frequent connection and disconnection, such as industrial control, consumer electronics, etc.

Characteristics of through-hole reflow soldering
1. Welding process:
Through hole reflow soldering is the process of inserting a connector into a through-hole installed on a circuit board, and then using reflow soldering technology to solder the connector to the PCB.

This process mainly involves melting solder at high temperatures to form a strong electrical connection with connector pins and PCB pads.

2. Scope of application:
Through hole reflow soldering is suitable for applications with high current or requiring high-strength connections, such as automotive electronics, industrial equipment, etc.

Selection and application
1. Factors to consider when choosing:
Rated current and voltage: Ensure that the specifications of the connector meet the current and voltage conditions to ensure safety.

Environmental adaptability: Choose appropriate materials and protection levels (such as waterproof and dustproof) according to the working environment.

2. Typical applications:
Automotive electronics: used for connecting multiple electronic modules in vehicles.

Household appliances: internal connections in household appliances such as washing machines, refrigerators, etc.

Industrial equipment: used for connecting devices such as PLCs (Programmable Logic Controllers), sensors, and actuators.

Welding Techniques
1. Welding temperature control: Ensure that the temperature is within the appropriate range to prevent overheating or incomplete melting of the solder.

2. Clean the solder pads and pins: Before soldering, ensure that the PCB solder pads and connector pins are free of oxidation or dirt to improve soldering quality.

3. Time control: The heating and cooling time of reflow soldering should be appropriately controlled to ensure the welding effect.

4. Test connection: After welding is completed, electrical testing should be conducted to ensure that the connection is good and meets the design requirements.

summary
The wire to board connector adopts through-hole reflow soldering technology, which can provide reliable and stable electrical connections and is an indispensable component in various electronic devices. When selecting and using, it is necessary to consider its rated parameters, environmental adaptability, and welding process depth to ensure optimal performance and reliability.

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